Semiconductor Chip Packing Line

Semiconductor Chip Packing Line

Suitable for pre-shipment packaging of semiconductor chips, applicable for inner packaging and outer packaging processes of products such as tray carriers, reel carriers, etc.
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Description

Semi-Auto Packing Line: Suitable for pre-shipment packaging of semiconductor chips, applicable for inner packaging and outer packaging processes of products such as tray carriers, reel carriers, etc.

Customized according to different products.

Product Feature And Application
  • Integrated design saves labor
  • Manual and automatic combination, applicable to a variety of packaging specifications.
  • Each process scan code, information comparison, to prevent mixing.
  • Temporary label comparison
  • Reel marking and labeling
  • Material bagging: desiccant, humidity card, reel
  • Vacuum and seal the bag
  • Packaging bag marking and labeling
  • Inner box marking and labeling
  • Paking into outbox
  • Weighing and stamping
  • Outbox inspection
  • Put in storage
  • Automatic access material
  • AGV transfering
  • Unmanned storage
  • Link into MES
  • All production information can be traced

Production Details

 

product-1062-720

 

Our Factory And Workshop

 

product-1062-508

product-1062-490

 

Certificate

 

product-1062-410

 

Cooperative Partner

 

product-1062-438

 

FAQ

 

Q: What is a semi-automatic packaging line?

A: A semi-automatic packaging line is a type of packaging equipment that combines manual and machine operations to meet various packaging specifications for customers.

Q: Which products is the semi-automatic packaging line suitable for?

A: Applicable to all chip inner packaging and outer packaging.

Q: How to choose a semi-automatic packaging line?

A: Customized according to product type.

 

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