The automatic wafer film sticking machine has become an indispensable piece of equipment due to its excellent performance. Its overall dimensions are 1700x1300x1850mm. The compact design not only saves space but also facilitates integration into existing production line layouts.
This film sticking machine has a high-efficiency production capacity, capable of processing 45 wafers per hour (UPH), significantly improving production efficiency and meeting the demands of large-scale production. It is suitable for wafers ranging from 8 to 12 inches in size and can accommodate various semiconductor wafer specifications. The wafer thickness range is from 150 to 900 µm, allowing it to handle wafers of different thicknesses stably, ensuring compatibility and reliability in the film sticking process.

In terms of precision control, the wafer placement accuracy is ±0.2 mm. Advanced positioning technology and precise control systems ensure accurate film sticking, effectively preventing defects caused by film misalignment and guaranteeing high-quality production.
The equipment operates on an AC 220V, 25A power supply, providing stable power to ensure continuous operation. The maximum heating temperature of the platform can reach 80°C, which can be adjusted to meet the requirements of different film sticking processes, optimizing the film sticking effect. Additionally, using CDA as the source gas ensures stable power for the operation of the equipment, maintaining smooth operation throughout the process.

Equipment Size	1700x1300x1850 (mm)	UPH	45pcs
Applicable Wafer Size	8-12"	Wafer Placement Accuracy	±0.2mm
Applicable Wafer Thickness	150-900um	Power Supply	AC 220V, 25A
Platform Heating Temp.	Max 80°C	Source Gas	CDA