Semiconductor Inspection Equipment

Your Professional Semiconductor Inspection Equipment Supplier

Chengdu Huazhuo Semi-Equipment Co., Limited specializes in providing customized and standard equipment, production line inspection and testing equipment, as well as laboratory reliability testing and failure analysis instruments for the semiconductor chip manufacturing, packaging, and testing industries.

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Why Choose Us

Our Factory

We has dozens of R&D personnel and more than 500 square meters of office space.Production base: Factory area: 3600㎡ (Shenzhen) +1000㎡ (Chengdu), the number of employees: more than 120 people.

Our Service

Offer comprehensive product information, technical specifications, and insights into packaging, testing, and factory construction. Develop customized solutions in response to the unique requirements of each client.

Professional Team

The company integrates independent research and development, design, manufacturing, and after-sales service. Leveraging a team of seasoned professionals in semiconductor chip manufacturing and packaging equipment processes, the company continuously innovates and optimizes its products and services.

Production Market

Our equipment has successfully passed the ISO9000 quality certification, with annual sales reaching 150 million in the Greater China region. Additionally, our products are exported to countries such as Singapore, India, Thailand, Mexico, Malaysia, and Vietnam.

Types of Semiconductor Inspection Equipment

Dimensional Metrology – Ensures precise measurement of critical dimensions (CD) in semiconductor devices, maintaining strict tolerances required for transistor scaling, circuit performance, and advanced lithography processes in modern chip manufacturing.

Optical Metrology – Uses non-contact techniques to analyze thin-film thickness, refractive index, and surface properties, ensuring accuracy in semiconductor fabrication without damaging delicate structures.

Electron Microscopy – Utilizes Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) to provide high-resolution imaging, allowing engineers to inspect nanometer-scale features, defects, and material compositions in semiconductor wafers.

X-ray Metrology – Applies X-ray diffraction (XRD) and X-ray fluorescence (XRF) to assess crystal structures, material stresses, and element composition, essential for analyzing advanced semiconductor materials and multi-layer chip designs.

Electrical Metrology – Evaluates resistivity, capacitance, contact resistance, and dielectric properties to ensure optimal semiconductor performance, helping identify electrical faults in integrated circuits, transistors, and interconnects before mass production.

Specification

Item	Model	I.C.T-9200
X-Ray Tube	Type	Transmissive Light Tube
	Voltage	100kv/110kv, 200μA/300μA
	Focal Spot Size	1 μm (Option 0.5 μm)
Platform	Resolution	1648*1644px
System Computer	Operating system	Windows 10
System Computer	Magnification	2500x
Structure	Plate rotation angle	60°
	Max. Loading Size	690*685mm
	Max. Inspection Area	670*665mm
	Max. Loading Weight	≤20kg
	Dimension	151017701850mm
	Weight	1800kg
	Platform movement	Manual/Auto

Tools and Techniques in Semiconductor Inspection Equipment

Critical Dimension (CD) Measurement: Ensures nanoscale feature dimensions are within tolerance, using SEM and stereometry to maintain process control in advanced semiconductor manufacturing.

Overlay Metrology: Aligns multiple lithographic layers with sub-nanometer accuracy, preventing pattern shift defects that impact circuit performance and yield in high-volume chip production.

Thin-Film Measurement: Evaluates film thickness, uniformity, and optical properties using techniques like ellipsometry and X-ray reflectometry to optimize deposition processes in semiconductor fabrication.

Defect Inspection: Detects sub-micron defects using automated optical and electron-beam inspection, improving semiconductor yield and reducing costly failures in high-density integrated circuits.

Atomic Force Microscopy (AFM):

Provides nanoscale surface characterization by scanning with an atomic-scale probe, essential for evaluating roughness, step heights, and material properties.

Scanning Electron Microscopy (SEM):

Captures high-resolution images of semiconductor structures, enabling precise analysis of feature dimensions, defects, and material composition at the nanometer scale.

Spectroscopic Ellipsometry:

Measures refractive index, layer thickness, and material properties using polarized light, ensuring precise process control in dielectric and thin-film applications.

Product Paramenters

Main technical indicators	Operating mode	Fully Automatic
	Equipment usage	2-4 inch wafer defect inspection
	Wafer size	2 "wafer φ 50mm; 4 "wafer φ 100mm, thickness: 300-1100 μ m. Warpage ＜ 0.5mm;
	Wafer size	Crystal round box: 2 "and 4" 25 slot Cassette;
	Equipment Layout	L1159mmW780mmH706.5mm
	Passline	1040mm±20mm
	Wafer feeding and receiving device	Single station+lifting module
	Visual Mapping System	Visual System
	Mapping	500W array camera+strip light source
	Detection device	Microscope
	Macroscopic inspection lamp	Halogen lamp
	Cassette wafer extraction	Single wishbone module
	Wafer transport	Double wishbone module
	Wafer positioning mechanical	Clamping+fiber optic sensor
	Front macroscopic inspection device:	Wafer lifting mechanism+wafer swing angle mechanism+wafer rotation axis
	Wafer detection	Microscope+XY manual platform
	Operating interface	Industrial computer+keyboard and mouse
	Communication method	CC-Link IE Field Or TCP IP
	Cleanliness	ISO Class 1000
	Material	Aluminum/Steel
	Rust proof treatment	Baking paint/Electroplating
	Negative pressure interface	Φ 6 Negative pressure trachea
	Negative pressure interface	The negative pressure gauge value must reach -80KPa or above
	Positive pressure interface	Φ 6 Positive pressure trachea
	Positive pressure interface	The digital pressure gauge value must reach 0.5~0.8MPa
	Power interface	220V AC power supply
	Power interface	External power supply power ≈ 1000W

Cooperation Process

productcate-792-420

Packing & Delivery

productcate-789-513

FAQ

Q: Do you provide software updates?

A: For customers who buy our machine, we can offer free upgraded software for you.

Q: How can I buy machine from you?

A: (1) Consult us on line or by e-mail;
(2) Negotiate and confirm the final price, shipping, payment method and other terms;
(3) Send you the proforma invoice and confirm your order;
(4) Make the payment according to the method put on proforma invoice;
(5) We prepare your order in terms of the proforma invoice after confirming your full payment . And 100% quality check before shipping;
(6) Send your order via express or by air or by sea.

Q: How about the spare parts?

A: After we deal down all the things , we will offer you a spare parts list for your reference.

Q: What is your delivery terms?

A: We support:FOB,CFR,CIF,EXW, DDP,DDU

Q: What is the payment terms?

A: Our normal payment terms is 30%TT in advance, the balance 70%TT before shipping.

We're well-known as one of the leading semiconductor inspection equipment enterprises in China. If you're going to buy high quality semiconductor inspection equipment, welcome to get free sample from our factory. Also, customized service is available.

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