Semiconductor Laser Machine
Chengdu Huazhuo Semi-Equipment Co., Limited specializes in providing customized and standard equipment, production line inspection and testing equipment, as well as laboratory reliability testing and failure analysis instruments for the semiconductor chip manufacturing, packaging, and testing industries.
-
![Auto Laser De-flash Machine]()
-
![Semiconductor Laser Decap Machine]()
Semiconductor Laser Decap MachineIt is suitable for semiconductor chip failure analysis to remove the surface molding compound of the chip by laser, so as to observe the internal failure point.read more -
![Laser Marking Machine]()
Laser Marking MachineIt is suitable for marking the bare frame before plastic sealing and the body after plastic sealing.read more
Why Choose Us
Our Factory
We has dozens of R&D personnel and more than 500 square meters of office space.Production base: Factory area: 3600㎡ (Shenzhen) +1000㎡ (Chengdu), the number of employees: more than 120 people.
Our Service
Offer comprehensive product information, technical specifications, and insights into packaging, testing, and factory construction. Develop customized solutions in response to the unique requirements of each client.
Professional Team
The company integrates independent research and development, design, manufacturing, and after-sales service. Leveraging a team of seasoned professionals in semiconductor chip manufacturing and packaging equipment processes, the company continuously innovates and optimizes its products and services.
Production Market
Our equipment has successfully passed the ISO9000 quality certification, with annual sales reaching 150 million in the Greater China region. Additionally, our products are exported to countries such as Singapore, India, Thailand, Mexico, Malaysia, and Vietnam.
Types of Semiconductor Laser Machine
We offer the following Product introduce:
Semiconductor Laser Decap Machine
It is suitable for semiconductor chip failure analysis to remove the surface molding compound of the chip by laser, so as to observe the internal failure point.
Proprietary software algorithm, no damage to the base material.
After laser decap, only one drop of acid can achieve decapping.
The support of the power chip can be dissolved to expose its lower wafer.
It can dissolve all kinds of solder of power MOS to prevent solder from blocking wafer.
Auto Laser De-flash Machine
Suitable for SME, SMB and other products to deflash.
The use of multiple positioning, no matter how the leadframe accuracy, can ensure the deflash accuracy.
Proprietary software algorithm, no damage to the leadframe.
Using the same magazine at loader and unloader, avoid mix device.
Effective removal of excess glue without residue
Laser Marking Machine
It is suitable for marking the bare frame before plastic sealing and the body after plastic sealing.
Double laser head design with high UPH
Compatible with leadframe marking function
Suitable for a variety of size leadframes
Only the corresponding Conversion Kit needs to be replaced when convert product.
We offer the following Product Specifications：
|
Semiconductor Laser Decap Machine |
|
|
Item |
Description |
|
Laser |
ND YVO4 1064nm |
|
Guide Laser |
632nm Laser Class 2 (Red Beam) |
|
Dimension |
840(W) x 705(D) x 1500(H) mm |
|
Weight |
Approx. 150 kg |
|
Handling IC Size |
2x2 mm ~ 100x100 mm |
|
Vision Camera |
Color |
|
Utility |
Rated Voltage : AC 220V, 1 Phase |
|
Program |
User Interface : Window Based Graphical User Interface |
|
Option |
Fume & Dust Collector |
|
Laser Marking Machine |
|
|
Laser Power |
20 W |
|
Laser Type |
Metal Tube |
|
Laser Cooling |
Air Cooled |
|
Laser Wavelength |
10.6 μm |
|
Pulse Repetition Rate |
≤ 20 KHz |
|
Marking Range |
60×60 mm ~ 300×300 mm |
|
Linear Speed |
≤ 7000 mm/s |
|
Laser Source Expected Life |
45,000 hours |
|
Min. Character Size |
0.20 mm |
|
Minimum Line Width |
0.05 mm |
|
Repeatability |
±0.01 mm |
|
Power Consumption |
800 W |
|
Electricity Requirements |
220V/50Hz/3.5A |
|
System |
Laser, Scanners, Power Source, Controls Electronics and Computer built into laser System |
|
User Interface |
Touch Screen Display / PC with Wondows 10 OS |
|
Connectivity |
USB Port for file and configuration transfer |
|
Environment Conditions |
15 degree C (59 degree F) to 40 degree C (104 degree F) external temperature / Humidity < 95% without condensation / Vibrations Free Area |
|
Supported |
.Plt,.Dxf,.Bmp,.Pcw,.Dxf,.Cdr |
|
Rotary Device |
Optional |
Precautions for use of Semiconductor Laser Machine
We will operate the machine strictly in accordance with the instruction manual of the laser marking machine provided by the manufacturer, and refuse to start the machine in a rude way.
Secondly, it is a problem of electrical protection. When we use or debug the CO2 laser, if we find that the line is damp or leaks and causes discharge, we should immediately turn off the power. In addition to cutting off the power supply during maintenance, high-voltage discharge should be carried out to prevent the danger of electric shock, and then measures should be taken to repair.
The power cord of the CO2 laser printing machine we use belongs to single-phase three-wire, we need to keep the chassis grounded well.After use, the light guide arm should be placed in a dry place to prevent mildew and damage to the lens during later use.
Packing & Delivery
The machine packing
Usually use the PE foam package
The base need wood package
The tape will fixed the machine on the container
The machine package arrange
The machine will arrange the drawing of each machine on the container before loading
Save the space for our client
Ensure the machine delivery 100% safty
Certificate
FAQ
We're well-known as one of the leading semiconductor laser machine enterprises in China. If you're going to buy high quality semiconductor laser machine, welcome to get free sample from our factory. Also, customized service is available.
semiconductor laser for precipitation, semiconductor laser with continuous wave output, semiconductor laser with broad linewidth