Laser Decap Machine: It is suitable for semiconductor chip failure analysis to remove the surface molding compound of the chip by laser, so as to observe the internal failure point.
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Equipment Size |
800x600x1500mm |
Repeat Accuracy |
±0.03m |
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Laser Power |
20W |
Power Supply |
AC 220V, 10A |
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Laser Wavelength |
1064nm |
Source Gas |
CDA |
Product Feature And Application
- Proprietary software algorithm, no damage to the base material.
- After laser decap, only one drop of acid can achieve decapping.
- The support of the power chip can be dissolved to expose its lower wafer.
- It can dissolve all kinds of solder of power MOS to prevent solder from blocking wafer.
- Provides kinds of decapping potion formula.
- The PI layer covered on the IC can be effectively dissolved to prevent the PI layer from affecting the microscopic observation.
- The IC wire can be maintained, convenient for subsequent failure analysis.
- With a visual function, the chip can be operated under the camera, easy observation.
Production Details
Our Factory And Workshop
Certificate
Cooperative Partner
FAQ
Q: What is a laser decap machine?
A: Laser decap machine is a kind of equipment that uses laser to remove the molding compound on the surface of the chip and facilitate the observation of the internal failure point.
Q: Which products is the laser decap machine suitable for?
A: Applicable to various package types of chips.
Q: Is there anything else you need to do after the laser is off?
A: A drop of acid is needed to dissolve a thin layer of plastic sealant on the chip.
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