China Fiber laser Decapsulation equipment Manufacturers Factory Suppliers
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Semiconductor Laser Decap MachineIt is suitable for semiconductor chip failure analysis to remove the surface molding compound of the chip by laser, so as to observe the internal failure point.read more
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Laser Marking MachineIt is suitable for marking the bare frame before plastic sealing and the body after plastic sealing.read more
Our patented semiconductor laser decapsulation ablation technology provides clean, accurate laser decapsulation, and more. Ideal Solution for IC Laser Decapsulation, Gel Removal, Cross-Sectioning,...
The baublys BL5500 is a standalone laser tool for laser decapsulation and ablation. This system offers the latest technology and features such as Z-axis with a lift capacity of 300mm and is...
Laser class one safety cabinet, no additional cost for laser protection. Application Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as revoe...
Precision industrial strength laser engraving, cutting, drilling and welding systems. With laser for every type of applications - CO₂ , Fiber, IR, Green, UV, and DUV Plasma...
Laser class one safety cabinet, no additional cost for laser protection. Application Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as revoe...
The Plaser™/Laser system combines the Plaser™, plasma decap and the BL5500 laser system into a convenient single system. The BSET EQ Plaser™ is the world's first, and best, automated plasma decapper....
