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The laser marking machine should be used in a dust-free, 10℃~35℃ environment as much as possible, keeping the optical components dry and dust-free.

The ultrasonic cleaning machine utilizes the cavitation, acceleration, and direct flow effects of ultrasonic waves in liquids to directly and indirect

With the continuous development of the semiconductor industry, the requirements for cleaning technology are also constantly increasing.

The rapid development of semiconductor technology has led to increasingly high requirements for device cleaning.

The wafer placement machine adopts a turret multi station structure, which compensates for picking, pasting, and photography simultaneously, and has m

Very reliable! The operating mode is very strong! The design of wafer placement machine breaks through the limitations of general placement technology