The principle and effect of ultrasonic cleaning machine

The ultrasonic cleaning machine utilizes the cavitation, acceleration, and direct flow effects of ultrasonic waves in liquids to directly and indirectly affect liquids and pollutants, dispersing, emulsifying, and peeling the pollutant layer to achieve the purpose of cleaning. This cleaning method can penetrate into the tiny gaps on the surface of semiconductor chips, thoroughly removing difficult to detect pollutants such as particles, organic matter, and metal ions. Therefore, ultrasonic cleaning machines exhibit efficient and thorough cleaning effects in semiconductor chip cleaning.