Semiconductor Taping & Detaping Machine
Chengdu Huazhuo Semi-Equipment Co., Limited specializes in providing customized and standard equipment, production line inspection and testing equipment, as well as laboratory reliability testing and failure analysis instruments for the semiconductor chip manufacturing, packaging, and testing industries.
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Wafer Lamination MachineSuitable for all sizes of wafer automatic taping, can be used for wafer grinding taping, can also be used for wafer cutting taping.read more
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Auto Wafer MounterSuitable for all sizes of wafer automatic taping, can be used for wafer grinding taping, can also be used for wafer cutting taping.read more
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Semi Auto Wafer MounterSuitable for all sizes of wafer taping, can be used for blue tape, UV tape, dry film.read more
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Semi Auto Strip Taping MachineSuitable for tape application before dicing of QFN and DFN packaged products. Applicable tape types: blue tape, UV tape.read more
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Auto Lead Frame Taping MachineFor lead frame automatic taping, can be used for taping before DB process, can not be used for taping after WB process.read more
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Auto De-taping MachineSuitable for de-taping for QFN, DFN products after molding process.read more
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PKG Sawing Taping UV Curing MachineSuitable for QFN, DFN and other products border cutting, taping, blank area degluing.read more
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Semi-auto De-taping MachineSuitable for de-taping for QFN, DFN products after molding process.read more
Why Choose Us
Our Factory
We has dozens of R&D personnel and more than 500 square meters of office space.Production base: Factory area: 3600㎡ (Shenzhen) +1000㎡ (Chengdu), the number of employees: more than 120 people.
Our Service
Offer comprehensive product information, technical specifications, and insights into packaging, testing, and factory construction. Develop customized solutions in response to the unique requirements of each client.
Professional Team
The company integrates independent research and development, design, manufacturing, and after-sales service. Leveraging a team of seasoned professionals in semiconductor chip manufacturing and packaging equipment processes, the company continuously innovates and optimizes its products and services.
Production Market
Our equipment has successfully passed the ISO9000 quality certification, with annual sales reaching 150 million in the Greater China region. Additionally, our products are exported to countries such as Singapore, India, Thailand, Mexico, Malaysia, and Vietnam.
Types and Features of Semiconductor Taping & Detaping Machine
We offer the following Product introduce:

Full Auto Wafer Mounter
Suitable for all sizes of wafer automatic taping, can be used for wafer grinding taping, can also be used for wafer cutting taping.
High mechanical positioning accuracy
High accuracy, controllable tension force, adjustable cutting angle
Fast and easy product conversion
Semi Auto Strip Taping Machine
Suitable for tape application before dicing of QFN and DFN packaged products. Applicable tape types: Blue tape, UV tape.
Applicable to different product sizes
Heating and vacuum functions for warping products
Dual platform design, high UPH


Auto Leadframe Taping Machine
For lead frame automatic taping, can be used for taping before DB process, can not be used for taping after WB process.
Dual gauge design, UPH high
Automatic take and place isolating paper function
There are no bubbles and dents after taping
Auto De-taping Machine
Suitable for de-taping for QFN, DFN products after molding process.
Applicable to different leadframe sizes
Heating and vacuum functions for warping products
Stack magazine auto loading and unloading, and a certain amount of cache
De-taping speed and Angle are adjustable

We offer the following Product Specifications:
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Full Auto Wafer Mounter |
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Equipment Size |
1700x1300x1850 (mm) |
UPH |
45pcs |
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Applicable Wafer Size |
8-12" |
Wafer Placement Accuracy |
±0.2mm |
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Applicable Wafer Thickness |
150-900um |
Power Supply |
AC 220V, 25A |
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Platform Heating Temp. |
Max 80°C |
Source Gas |
CDA |
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Semi Auto Strip Taping Machine |
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Equipment Size |
1500x1200x1800 (mm) |
UPH |
240pcs |
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Applicable Strip Size |
Max: 100x300mm |
Taping Accuracy |
±0.5mm |
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Applicable Ring Size |
Max 12" |
Power Supply |
AC 220V, 20A |
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Platform Heating Temp. |
Max 120°C |
Source Gas |
CDA |
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Auto De-taping Machine |
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Equipment Size |
2200x1600x1900 (mm) |
Accuracy |
±0.3mm |
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Applicable Leadframe Size |
Max: 100x300mm |
Power Supply |
AC 220V, 20A |
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Platform Heating Temp. |
Max 120°C |
Source Gas |
CDA |
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UPH |
280pcs |
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Packing & Delivery
The machine packing
Usually use the PE foam package
The base need wood package
The tape will fixed the machine on the container
The machine package arrange
The machine will arrange the drawing of each machine on the container before loading
Save the space for our client
Ensure the machine delivery 100% safty
Certificate

FAQ
We're well-known as one of the leading semiconductor taping & detaping machine enterprises in China. If you're going to buy high quality semiconductor taping & detaping machine, welcome to get free sample from our factory. Also, customized service is available.
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