Full Auto Wafer Mounter: Suitable for all sizes of wafer automatic taping, can be used for wafer grinding taping, can also be used for wafer cutting taping.
|
Equipment Size |
1700x1300x1850 (mm) |
UPH |
45pcs |
|
Applicable Wafer Size |
8-12" |
Wafer Placement Accuracy |
±0.2mm |
|
Applicable Wafer Thickness |
150-900um |
Power Supply |
AC 220V, 25A |
|
Platform Heating Temp. |
Max 80°C |
Source Gas |
CDA |
Product Feature And Application
- High mechanical positioning accuracy
- High accuracy, controllable tension force, adjustable cutting angle
- Fast and easy product conversion
- Compact design and small footprint
- Positioning device to ensure high taping precision
- SECS/GEM
Production Details
Internal Layout
Our Factory And Workshop
Certificate
Cooperative Partner
FAQ
Q: What is the main function of wafer mounter?
A: The main function of the wafer mounter is to attach the cutting tape to the back of the wafer or the cutting frame, while also stripping the protective tape from the patterned wafer surface. Such devices play a key role in semiconductor manufacturing, ensuring wafer integrity and ease of subsequent processing.
Q: Wafer mounter for which wafer sizes?
A: Wafer mounter are usually suitable for 4, 6, 8, 12 inch wafers, the specific size of the wafer needs to be determined by the device model and specifications.
Q: What are the technical highlights or features of wafer mounter?
A: • Unique vacuum paste technology: Ensures a tight fit between wafer and tape.
• High precision alignment system: Realize the accurate alignment and fit of tape and wafer.
• Automated operation: Improve production efficiency and reduce manual intervention.
• Multi-dimensional adaptability: The ability to handle wafers of different sizes.
• Coaxial system (optional): Improves film accuracy and stability.
• Protective tape Peel performance: Easily peel protective tape from patterned wafer surfaces.
Q: What are the types of wafer mounter?
A: Wafer mounter can be divided into automatic wafer mounter and semi-automatic wafer mounter according to the degree of automation and function. The automatic wafer mounter can completely automate the lamination process. Semi-automatic wafer mounter may require operators to participate in some operations, but also have high-precision laminating capabilities.
Q: How to choose the right wafer mounter?
A: When choosing the right wafer mounter, the following factors can be considered:
• Wafer size: Select the device that can handle the desired wafer size according to the actual needs.
• Taping accuracy: For occasions where high precision taping is required, equipment with high precision alignment system should be selected.
• Production efficiency: Full auto wafer mounter is generally more productive than semi-automatic machines.
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